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Base Material: |
FR - 4 Epoxy
Glass Laminate
Standards: IPC4101: Flammability UL 94 V-0;
RoHS Compliant |
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Base Material
Thickness: |
0.8; 1.0;
1.2; 1.6mm - Single & Double Sided
2.4; 3.2 - Double Sided Only (Subject to
material stock) |
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Finished Copper
Thickness: |
1.6mm S/S,
D/S & 1.0 D/S only: 35 or 70 micron |
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Maximum Pcb
Size: |
450 x 540mm |
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Maximum Pcb Size
for Gold Edge Connector: |
340mm
(Connector Side) |
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Maximum Pcb Size
for Bare Board Testing: |
320 x 410mm |
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Minimum Hole
Diameter: |
PTH - Up to
1.6mm max material thickness: 0.4mm
(0.3mm subject to prior consultation & BBT
(Bare Board Test / Electrical Test is
mandatory)
PTH - Material thickness 2.0 - 3.2
thickness: 0.6mm
Non-PTH - Up to 3.2mm max material
thickness: 0.5mm |
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Tolerance of
Hole Diameters: |
Non-THP
Holes: 0.5mm to 1.6mm: ± 0.05mm
1.6mm to 5.0mm: ± 0.1mm
PTH Holes:
0.4mm to 0.95mm ± 0.05mm
1.0mm to 2.4mm ± 0.1mm
2.5mm to 5.0mm ± 0.15mm |
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Minimum Annular
Ring (Pattern Registration): |
Non-PTH
Hole: 0.15mm PTH
Hole: 0.08mm
Non-PTH Hole for 70 micron Copper: 0.3mm
PTH Hole for 70 micron Copper: 0.3mm |
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Minimum
Conductor Width: |
Minimum
design width: 6 Thou
(0.16mm) BBT Mandatory
8 Thou (0.2mm) preferred |
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Minimum
Conductor Spacing: |
Minimum
design width: 6 Thou
(0.16mm) BBT Mandatory
8 Thou (0.2mm) preferred |
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Landless Hole to
Conductor Spacing: |
Minimum
design width: 7 Thou
(0.18mm) BBT Mandatory
8 Thou (0.2mm) preferred |
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Land Size by
Design: |
Annular ring
should not be less than 0.18mm |
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Plating
Thickness: |
Copper:
(Through Hole):
20 micron minimum
25 micron normal
Gold on Nickel (Edge connector)
1.3 micron
Nickel:
2.5 micron |
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Finishes: |
Solder Hot
Air Level (HAL Lead Free) ± 6 micron minimum |
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Solder Resist
(Photo-imagable): |
Curtain
coated - Green
Screen coated - Blue, Red, White, Black &
Yellow |
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Minimum Resist
Thickness: |
10 micron
(measured at conductor knee) |
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Notation Ink
(Legends, Ident): |
White
(preferred), Yellow, Black |
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Other: |
Carbon
Contacts |
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Temporary Solder
Resist Mask: |
Peelable
Blue
Note: Max Hole Diameter for Hole Testing is
1.1mm |
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Electrical Bare
Board Testing (BBT): |
Double Sided
- Minimum pitch 12mil (0.3mm) SMT Capability |
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V-Scored Panels: |
See our
V-Score Specification - Rev 0.1993 |
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Quality: |
ISO
9001:2008
ANSI/IPC 600 International PCB Manufacturing
Standards
(ANSI: American National Standards
Institute)
(IPC: Institute for Interconnecting and
Packaging Electronic Circuits) |
