Bosco Printed Circuit Specialists Bosco Printed Circuit Specialists
Printed Circuit Boards Bosco Printed Circuit Boards
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Circuit Board Manufacturing Capabilities:

 
     
     
 
 

Base Material:

FR - 4 Epoxy Glass Laminate
Standards: IPC4101: Flammability UL 94 V-0; RoHS Compliant

Aluminium Base Pcb's: Thickness 1.5mm S/S
     
 

Base Material Thickness :

0.8; 1.0; 1.2; 1.6mm - Single & Double Sided
2.4; 3.2 - Double Sided Only (Subject to material stock)
     
 

Finished Copper Thickness:

1.6mm S/S, D/S & 1.0 D/S only: 35 or 70 micron
     
 

Maximum Pcb Size:

450 x 540mm
     
 

Maximum Pcb Size for Gold Edge Connector:

340mm (Connector Side)
     
 

Maximum Pcb Size for Bare Board Testing:

320 x 410mm
     
 

Minimum Hole Diameter:

PTH - Up to 1.6mm max material thickness: 0.4mm
(0.3mm subject to prior consultation & BBT (Bare Board Test / Electrical Test is mandatory)
PTH - Material thickness 2.0 - 3.2 thickness: 0.6mm
Non-PTH - Up to 3.2mm max material thickness: 0.5mm
     
 

Tolerance of Hole Diameters:

Non-THP Holes: 0.5mm to 1.6mm:  0.05mm
                        1.6mm to 5.0mm:  0.1mm
PTH Holes:        0.4mm to 0.95mm 0.05mm
                        1.0mm to 2.4mm   0.1mm
                        2.5mm to 5.0mm   0.15mm
     
 

Minimum Annular Ring (Pattern Registration):

Non-PTH Hole: 0.15mm     PTH Hole: 0.08mm
Non-PTH Hole for 70 micron Copper: 0.3mm
PTH Hole for 70 micron Copper: 0.3mm
     
 

Minimum Conductor Width:

Minimum design width:     6 Thou (0.16mm) BBT Mandatory
                                      8 Thou (0.2mm) preferred
     
 

Minimum Conductor Spacing:

Minimum design width:     6 Thou (0.16mm) BBT Mandatory
                                      8 Thou (0.2mm) preferred
     
 

Landless Hole to Conductor Spacing:

Minimum design width:     7 Thou (0.18mm) BBT Mandatory
                                      8 Thou (0.2mm) preferred
     
 

Land Size by Design:

Annular ring should not be less than 0.18mm
     
 

Plating Thickness:

Copper: (Through Hole):                   20 micron minimum
                                                     25 micron normal
Gold on Nickel (Edge connector)      1.3 micron
Nickel:                                           2.5 micron
     
 

Finishes:

Solder Hot Air Level (HAL Lead Free) 6 micron minimum
     
 

Solder Resist (Photo-imagable):

Curtain coated - Green
Screen coated - Blue, Red, White, Black & Yellow
     
 

Minimum Resist Thickness:

10 micron (measured at conductor knee)
     
 

Notation Ink (Legends, Ident):

White (preferred), Yellow, Black
     
 

Other:

Carbon Contacts
     
 

Temporary Solder Resist Mask:

Peelable Blue
Note: Max Hole Diameter for Hole Testing is 1.1mm
     
 

Electrical Bare Board Testing (BBT):

Double Sided - Minimum pitch 12mil (0.3mm) SMT Capability
     
 
V-Scored Panels:
See our V-Score Specification - Rev 0.1993
     
 
Quality:
ISO 9001:2008
ANSI/IPC 600 International PCB Manufacturing Standards
(ANSI: American National Standards Institute)
(IPC: Institute for Interconnecting and Packaging Electronic Circuits)
 
     
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